专利名称：ELECTRICALLY CONDUCTIVE JOINING
COMPOSITION, ELECTRICALLY
CONDUCTIVE JOINING SHEET, ELECTRONICCOMPONENT, AND PRODUCTION METHODFOR SAME
发明人：FURUKAWA, Yoshihiro,EBE, Hirofumi申请号：EP14840359.5申请日：20140801公开号：EP3040392A4公开日：20170322
摘要：An electrically conductive joining composition contains a solder particle and aresin component containing a thermosetting resin and a curing agent. The viscosity of theresin component at the melting point of the solder particle is 8000 Pa·s or more.
申请人：Nitto Denko Corporation
地址：1-2 Shimohozumi 1-chome Ibaraki-shi, Osaka 567-8680 JP
国籍：JP
代理机构：Hoffmann Eitle
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