专利名称:JACK CONNECTOR DEVICE
发明人:KEE, Eric Chan,KUANG, Kan, Meng Bik 327
Jurong East Street 31
申请号:EP93920286.0申请日:19930824公开号:EP0659301A1公开日:19950628
摘要:(57)< Abstract > < Objective >Multiple modular jacks installation possiblejiyatsuThe kukonekuta device is offered. < Constitution >Stretching in the housing 14which is done, housing 1According to the stretching direction of 4, multiple socketsections 16 in the foremost string distributionYou have attended. Each socket section 16respectively oneIn order to accept the modular jack, adaptation,Contact terminal 18being laid out in each socket section 16It is. Therefore, each socket section 16
respectively oneIt is suitable to the modular jack connector. Housing 1By implementing 4on the etched circuit substrate, multiple mojiyurajiyatsukukonekuta at one time in etchedcircuit substrateWhen it implements, similar function is achieved.
申请人:BERG TECHNOLOGY, INC.
地址:1 East First Street Reno, NV 89501 US
国籍:US
代理机构:Barnard, Eric Edward
更多信息请下载全文后查看
因篇幅问题不能全部显示,请点此查看更多更全内容