Test arrangement having chips of a first substrate

专利名称：Test arrangement having chips of a first

substrate on a second substrate and chipsof the second substrate on a third substrate

发明人：Martin Kerber申请号：US12152925申请日：20080519公开号：US07652493B2公开日：20100126

专利附图：

摘要：The invention relates to a method for arranging chips of a first substrate on asecond substrate, in which the chips are grouped at least into first chips and into second

chips, the first chips of the first substrate are singulated and the singulated first chips arearranged on the second substrate in such a way that each of the first chips on the secondsubstrate is unambiguously assigned to the associated first chip on the first substrate.

申请人：Martin Kerber

地址：München DE

国籍：DE

代理机构：Brinks Hofer Gilson & Lione

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