Method for interconnecting a flat panel display ha

专利名称：Method for interconnecting a flat panel

display having a non-transparent substrateand devices formed

发明人：Yuan-Chang Huang,Tai-Hong Chen申请号：US09732863申请日：20001208公开号：US06501525B2公开日：20021231

专利附图：

摘要：A method for simultaneously forming a flat display panel and bonding to aprinted circuit board is disclosed in which a silicon wafer is first supplied and then coated

with an alignment layer, a multiplicity of spacers are then mounted to the wafer before itis severed into a multiplicity of dies. A frame seal is then applied to the periphery of thedie, while a multiplicity of metal leads is formed on the die for electrical communicationwith a multiplicity of thin film transistors. A glass plate is then assembled to the siliconsubstrate by the frame seal, while simultaneously bonded to a printed circuit board in abonder apparatus under pressure by utilizing a conductive material such as silver paste,an anisotropic conductive film or an isotropic conductive adhesive. The bonding of theprinted circuit board to the flat panel display module occurs simultaneously with theformation of interconnections between the printed circuit board and the multiplicity ofmetal leads on the silicon substrate through a multiplicity of transparent electrodesformed on the glass plate of the flat panel display. The present invention novel structureallows the use of a conventional alignment apparatus such as CCD for optical alignmentand a conventional bonder apparatus since a glass substrate is completely exposed andoptical transmission can be achieved through the flat panel display module.

申请人：INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

代理机构：Tung & Associates

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