Electronic assembly and cooling thereof

专利名称：Electronic assembly and cooling thereof发明人：Krishna Seshan,Yves André

Volckaert,Prosenjit Ghosh

申请号：US09660859申请日：20000913公开号：US06377457B1公开日：20020423

专利附图：

摘要：An electronic assembly is provided. An electronic substrate of the assembly hasa plurality of conductive lines to transmit signals, and a cooling opening therethrough.The cooling opening has an inlet to allow fluid into the electronic substrate, a section in

the electronic substrate through which the fluid flows from the inlet, and an outlet fromwhich the fluid flows from the section out of the electronic substrate. A semiconductordie of the assembly is mounted to the electronic substrate. The die has an electroniccircuit connected to the metal lines so that signals are transmitted between the

electronic circuit and the metal lines, operation of the electronic circuit causing heating ofthe die, heat being transferred from the die to the electronic substrate from where heatis transferred to the fluid flowing through the section.

申请人：INTEL CORPORATION

代理机构：Blakely, Sokoloff, Taylor & Zafman LLP

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