专利名称：Laser cutting method and method of
manufacturing organic light-emitting device
发明人：Won-Kyu Lim,Hyun-Chul Lee,Alexander
Voronov,Jae-Seok Park,Cheol-Lae Roh
申请号：US12929061申请日：20101228
公开号：US20110155705A1公开日：20110630
专利附图：
摘要：A laser cutting method includes providing a multi-layered substrate, such thatthe multi-layered substrate includes a circuit pattern between stacked first and second
substrates, and removing a part of the second substrate by irradiating a laser beam onthe second substrate, the laser beam being irradiated at an oblique angle with respect toan upper surface of the second substrate.
申请人：Won-Kyu Lim,Hyun-Chul Lee,Alexander Voronov,Jae-Seok Park,Cheol-Lae Roh
地址：Yongin-CIty KR,Yongin-city KR,Yongin-city KR,Yongin-city KR,Yongin-city KR
国籍：KR,KR,KR,KR,KR
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