Semiconductor devices including stacking spacers t

专利名称：Semiconductor devices including stacking

spacers thereon, assemblies including thesemiconductor devices, and methods

发明人：James M. Derderian申请号：US09939258申请日：20010824

公开号：US20030038356A1公开日：20030227

专利附图：

摘要：A method for assembling semiconductor devices includes providing a firstsemiconductor device, securing spacers to noncircuit bond pads of the first

semiconductor device, and positioning a second semiconductor device on the spacers.Adhesive material may be applied to a surface of one or both of the first and secondsemiconductor devices prior to positioning of the second semiconductor device, orintroduced between first and second semiconductor devices. The noncircuit bond padsmay be electrically isolated from other structures of the first semiconductor device orcommunicate with a ground or reference voltage plane, in which case the back side of thesecond semiconductor device may communicate with the ground or reference voltageplane upon being positioning against the spacers. Additional semiconductor devices may

be added to the assembly. The first semiconductor device may be associated with asubstrate. Assemblies and packages at least partially fabricated by the method are alsodisclosed.

申请人：DERDERIAN JAMES M

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