FOCAL PLANE ARRAY AND METHOD FOR MANUFACTURING THE

专利名称：FOCAL PLANE ARRAY AND METHOD FOR

MANUFACTURING THE SAME

发明人：Adriana Lapadatu,Gjermund Kittilsland申请号：US13582103申请日：20110301

公开号：US20130026596A1公开日：20130131

专利附图：

摘要：A method of forming a focal plane array by: preparing a first wafer havingsensing material provided on a surface, which is covered by a sacrificial layer; preparing asecond wafer including read-out integrated circuit and a contact pad, which is covered byanother sacrificial layer into which are formed support legs in contact with the contactpad, the support legs being covered with a further sacrificial layer; bonding the sacrificiallayers of the first and second wafers together such that the sensing material istransferred from the first wafer to the second wafer when a sacrificial bulk layer of thefirst wafer is removed; defining a pixel in the sensing material and forming a conductivevia through the pixel for providing a connection between an uppermost surface of thepixel and the supporting legs; and removing the sacrificial layers to release the pixel, withthe supporting legs underneath it.

申请人：Adriana Lapadatu,Gjermund Kittilsland

地址：Horten NO,Horten NO

国籍：NO,NO

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