专利名称：Pressure-sensitive adhesive sheet for dicing
and dicing method
发明人：Takahashi, Tomokazu申请号：EP08015713.4申请日：20080905公开号：EP2033996A1公开日：20090311
专利附图：
摘要：The present invention relates to a pressure-sensitive adhesive sheet for dicingcomprising a substrate layer and an active energy ray-curable pressure-sensitive adhesivelayer provided on the substrate layer, in which the active energy ray-curable pressure-
sensitive adhesive layer has a gel fraction before irradiation with an active energy ray of50% or more. Furthermore, the invention also provides a method for dicing an adherend,which comprises attaching the pressure-sensitive adhesive sheet for dicing to an
adherend, followed by cutting the adherend using a round blade. The pressure-sensitiveadhesive sheet for dicing of the invention is free from leaving any adhesive residue onchips, from peeling of the pressure-sensitive adhesive sheet from the ring for fixing it, aswell as from leaving any paste residue on the ring.
申请人：Nitto Denko Corporation
地址：1-2, Shimohozumi 1-chome Ibaraki-shi, Osaka 567-8680 JP
国籍：JP
代理机构：Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
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