Lead carrier with print-formed package components

专利名称：Lead carrier with print-formed package

components

发明人：Philip E. Rogren申请号：US14017172申请日：20130903公开号：US08865524B2公开日：20141021

专利附图：

摘要：A lead carrier provides support for an integrated circuit chip and associatedleads during manufacture as packages containing such chips. The lead carrier includes atemporary support member with multiple package sites. Each package site includes a die

attach pad surrounded by a plurality of terminal pads. The pads are formed of a sinteredelectrically conductive material. A chip is mounted upon the die attach pad and wirebonds extend from the chip to the terminal pads. The pads, chip and wire bonds are allencapsulated within a mold compound. The temporary support member can be peeledaway and then the individual package sites can be isolated from each other to providecompleted packages including multiple surface mount joints for mounting within anelectronics system board. Edges of the pads are contoured to cause the pads to engagewith the mold compound to securely hold the pads within the package.

申请人：EoPlex Limited

地址： CN

国籍：CN

代理机构：Heisler & Associates

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