Method for the production of a component structure

专利名称：Method for the production of a component

structure

发明人：Franz Hirler申请号：US12105852申请日：20080418公开号：US07960285B2公开日：20110614

专利附图：

摘要：A method for the production of a component structure. On embodimentprovides a semiconductor body having a first side. A first trench and a second trench areproduced, which extend into the semiconductor body proceeding from the first side and

are arranged at a distance from one another in a lateral direction of the semiconductorbody. A first material layer in the first trench is produced. A third trench proceeding fromthe second trench is produced, extending as far as the first material layer in the firstlateral direction.

申请人：Franz Hirler

地址：Isen DE

国籍：DE

代理机构：Dicke, Billig & Czaja, PLLC

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