SIEGET25NPN Silicon RF Transistor
BFP490 For high power amplifiers
Compression point P-1dB = 26.5 dBm at 1.8 GHz maxim. available Gain Gma = 8.5 dB at 1.8 GHz
453 Transition frequency fT > 17 GHz Gold metallization for high reliability SIEGET 25 GHz fT - Line
12VPW05980ESD: Electrostatic discharge sensitive device, observe handling precaution!
TypeBFP490
Maximum RatingsParameter
MarkingAOs
1 = B
Pin Configuration
2 = E3 = C4 = C5 = E
SymbolVCEOVCBOVEBOICIBPtotTjTATstg
PackageSCT595
UnitV
Value4.5151.5600601000150-65 ... 150-65 ... 150
Collector-emitter voltageCollector-base voltageEmitter-base voltageCollector currentBase current
Total power dissipation TS 85 °C 1)
Junction temperatureAmbient temperatureStorage temperature
mAmW°C
Thermal ResistanceJunction - soldering point2)
RthJS
65
K/W
1T is measured on the emitter lead at the soldering point to the pcbS
2For calculation of R
thJA please refer to Application Note Thermal Resistance
1Aug-14-2001
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SIEGET25Electrical Characteristics at TA = 25°C, unless otherwise specified.ParameterDC characteristics
Collector-emitter breakdown voltage IC = 1 mA, IB = 0
Collector-base cutoff current VCB = 5 V, IE = 0
Emitter-base cutoff current VEB = 1.5 V, IC = 0 DC current gain
IC = 200 mA, VCE = 3 V
AC characteristics (verified by random sampling)Transition frequency
IC = 300 mA, VCE = 3 V, f = 0.2 GHz IC = 300 mA, VCE = 3 V, f = 0.5 GHzCollector-base capacitance VCB = 2 V, f = 1 MHz
Collector-emitter capacitance VCE = 2 V, f = 1 MHz
Emitter-base capacitance VEB = 0.5 V, f = 1 MHzNoise figure
IC = 100 mA, VCE = 2 V, ZS = ZSopt , f = 1.8 GHz
Power gain, maximum available 1)
IC = 200 mA, VCE = 2 V, ZS = ZSopt, ZL = ZLopt , f = 1.8 GHz
Insertion power gain
IC = 200 mA, VCE = 2 V, f = 0.5 GHz, ZS = ZL = 50
Third order intercept point
IC = 300 mA, VCE = 3 V, ZS=ZSopt , ZL=ZLopt , f = 1.8 GHz
1dB Compression point
IC = 300 mA, VCE = 3 V, f = 1.8 GHz, ZS=ZSopt , ZL=ZLopt
1G = |S / S| (k-(k2-1)1/2)ma2112
BFP490Symbol
min.
V(BR)CEOICBOIEBOhFE
4.5--50
Valuestyp.5--90
max.-1800400-
Unit
VnAµA-
fT
CcbCceCebF
12.5-----
17.5153.76.311.53.3
--5---
GHz
pF
dB
Gma
-8.5-
|S21|2-8.5-
IP3
-35-dBm
P-1dB
-26.5-
2Aug-14-2001
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SIEGET25SPICE Parameters (Gummel-Poon Model, Berkley-SPICE 2G.6 Syntax) :Transistor Chip Data
BFP490IS =VAF =NE =VAR =NC =RBM =CJE =TF =ITF =VJC =TR =MJS =XTI =
0.45124.6651.996216.0351.3391.07541.2273.91473.27930.98321.11500
fAV-V-
BF =IKF =BR =IKR =RB =RE =VJE =XTF =PTF =MJC =CJS =XTB =FC =
114.960.7693921.040.0900332.12620.324760.932660.6166400.34153000.75835
-A-A
NF =ISE =NR =ISC =IRB =RC =MJE =VTF =CJC =XCJC =VJS =EG =TNOM
RS =
1.14721.5911.35313.74790.176830.107370.368850.273486152,10.30,751.11300
tbd
-pA-fAmA
V-deg-F--
fFpsmAVns--
-VfF-VeVK
C'-E'-Diode Data (Berkley-SPICE 2G.6 Syntax) :
IS =tbdfAN =
tbd-
All parameters are ready to use, no scaling is necessary
Package Equivalent Circuit:
CCBLBI = LBO = LCIC’-E’-DiodeCCELCO0.850.30.150.040.390.21502.2500nHnHnHnHnHnHfFfFfFBLBOLBIB’TransistorChipE’C’CLEI = LEO = LCI = LCO = CBE = CCB = CCE = CBELEILEOEEHA07389Valid up to 3GHzThe SCT-595 package has two emitter leads. To avoid high complexity of the package equivalent circuit, both leads are combined in one electrical connection.
Extracted on behalf of Infineon Technologies AG by:Institut für Mobil-und Satellitentechnik (IMST)
For examples and ready to use parameters please contact your local Infineon Technologies distributor or sales office to obtain a Infineon Technologies CD-ROM or see Internet:http://www.infineon.com/silicondiscretes
3Aug-14-2001
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SIEGET25BFP490For non-linear simulation:
Use transistor chip parameters in Berkeley SPICE 2G.6 syntax for all simulators.
If you need simulation of the reverse characteristics, add the diode with the C'-E'- diode data between collector and emitter.
Simulation of package is not necessary for frequencies < 100MHz.
For higher frequencies add the wiring of package equivalent circuit around the non-linear transistor and diode model.
Note:
This transistor is constructed in a common emitter configuration. This feature causes an additional reverse biased diode between emitter and collector, which does not effect normal operation.
CBEEEHA07307Transistor Schematic Diagram
The common emitter configuration shows the following advantages:
Higher gain because of lower emitter inductance.
Power is dissipated via the grounded emitter leads, because the chip is mounted on copper emitter leadframe.
Please note, that the broadest lead is the emitter lead..
4Aug-14-2001
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Total power dissipation Ptot = f (TS)
1200 mW1000 900 to800 t700 600 500 400 300 200 100 0 020406080100120°C150TSPermissible Pulse Load RthJS = f (tp)
10 2 K/W
SJht10 1 0.50.20.10.050.020.010.005D = 010 0 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 s10 0
tpSIEGET25BFP490Transition frequency fT = f (IC)f = 200 MHz
VCE = parameter in V
20 GHz
3116 0.514 Tf12 10 8 6 4 2 0 050100150200250300350400mA500ICPermissible Pulse Load Ptotmax/PtotDC = f (tp)
10 2 CDtotP- / xamtoD = 0tP0.0050.0110 1 0.020.050.10.20.510 0 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 s10 0
tp5Aug-14-2001
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Power gain Gma, Gms, |S21|2 = f (f)VCE = 2 V, IC = 200 mA
dB
48 36 32 28 24 20 16 Gms12 8 4 Gma0 -4 -8 |S21|2-12 012345GHz7fPower gain Gma,Gms = f (VCE)IC=200mA
f = parameter in GHz
26 dB22 0.520 18 16 0.8114 12 1.810 28 2.56 4 2 0 00.511.522.533.5V4.5VCESIEGET25BFP490Power gain Gma, Gms = f (IC)VCE = 2V
f = parameter in GHz
24 dB20 0.518 16 0.8G14 112 10 1.88 22.56 4 2 0 050100150200250300350400mA500ICCollector-base capacitance Ccb = f (VCB) f = 1MHz
10 pFbcC6 4 2 0 00.511.522.53V4VCB6Aug-14-2001
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SIEGET25BFP490Noise figure F = f (IC)VCE = 2 V, ZS = ZSopt
6.5 dB5.5 5 4.5 4 3.5 3 2.5 2 1.5 f = 0.45 GHz1 f = 0.9 GHzf = 1.8 GHz0.5 0 050100150200250300350400mA500IC7Aug-14-2001
F
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