专利名称：STRUCTURE MANUFACTURING METHOD发明人：Tomofumi Katayama,Takashi Kakinoki申请号：US14123015申请日：20120727
公开号：US20140079876A1公开日：20140320
专利附图：
摘要：A structure () including (i) a casing () made of a dielectric and (ii) a conductingmember () embedded in the casing () so as to be through the casing () is manufactured byinsert molding. The conducting member () is provided with a recess (), and an upper mold() is provided with a protrusion () corresponding to the recess (). The conducting member
() is positioned to be fixed in the mold by fitting the protrusion () in the recess ().
申请人：Tomofumi Katayama,Takashi Kakinoki
地址：Osaka-shi JP,Osaka-shi JP
国籍：JP,JP
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